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SEBM systems

Y150

Open source for forming process, convenient and quick to develop new material system

Suitable for R&D and small batch production of new material in research industry

Max.build size:170×170×180 mm

Y150
Functional advantages
  • The forming process is open source, and development of new material system is convenient and quick.

  • Less powder loading per heat, low cost of machine using and maintenance.

  • Smaller forming chamber size (100×100×140 mm) is optional and material selection is more flexible.

  • The preheating temperature of the powder bed can reach more than 760°C, which can form brittle and easily cracked materials with small internal stress of parts.

  • The down powder-feeding technology allows for real-time monitoring of powder residue, improving the accuracy and stability of powder extraction and spreading, and reducing the requirement for powder fluidity during printing process.

  • Strong electron beam penetration ability, deeper molten pool, higher energy absorption conversion rate,faster forming speed and denser formed parts.

  • Purer parts are formed in vacuum environment with low oxygen increment. Greater design freedom,less dependence on support and no subsequent heat treatment.

  • Equipped with various safety protection systems and automatic fault handling.


Main technical parameters

Max.build size

170×170×180 mm3

Beam power rating

3 kW

Electron accelerating voltage

60 kV

Beam current

0~50 mA

Filament life

≥60 h

Cathode type

Directly heated tungsten cathode

Min.beam diameter

≤200 μm

Powder bed preheating process , substrate preheating temperature

760 ℃

The thickness of each layer of powder0.035~0.5mm(Can be adjusted)

Ultimate vacuum of the forming chamber

5×10-3 Pa

Working vacuum(1~2)×10-1 Pa

Build accuracy of components 

±0.3 mm/100mm

Density of physical parts≥99.4%(Take TC4 as an example)

External dimension

2070×1405×2405 mm(L×W×H)

Machine weight

2.2 t

CAD (interface)

STL

Control software

SEBM-ICS


Supporting materials

Titanium and Titanium alloy; Tungsten, Molybdenum, Tantalum, Niobium and other refractory metals; Titanium Aluminum alloy; Brittle and difficult processed materials; Copper and Copper alloy; Zirconium alloy; Nickel-base superalloy; Ceramics and metallic composites.

Application Cases
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Full plate acetabular cups
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Full plate interbody fusion apparatus
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Ta implant
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Outer cage induction coil
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TiAl blade
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